Having completed all project development phases of its ‘Multi Busbar Connector’ and its ‘Multi Busbar Module’ technology before launching a production-ready tool next year, SCHMID will be showcasing the prototype results at EU PVSEC next week.

Using its ‘InSecT’ (inline selective emitter technology) and around 40 micron wide plated contact fingers known in-house as HiMeT (contact-free high-efficiency metallization technology), SCHMID claims it has enabled a 0.6% absolute efficiency gain compared to a 3-busbar solar cell design.

Significant reductions in shading are said to be a key feature of the efficiency improvements. Contact-free inkjet printing combined with wet bench etching processes and plating technology were also claimed to be key features. The cell back side is 100% silver-free due to the use of SCHMID’s ‘TinPad’ technology.

The reduction in silver consumption on the front and back side of the cell could also prove attractive as the company cites a 75% decrease compared to a 3-busbar screen printed cell.

The Multi Busbar Connector subsequently attaches 15 wire busbars to the front side of these basic cells using contact-free infrared soldering and at the same time joins multiple cells into a string. The smaller distances between the wires reduce the series resistance of the cells and thus increase the fill factor by up to 0.3%.

SCHMID claims that the ‘Multi Busbar Connector’ attaches 15 wire busbars to the front side of the basic cell using contact-free infrared soldering while simultaneously joining multiple cells into a string. The smaller distances between the wires are said to reduce the series resistance of the cells and thus increase the fill factor by up to 0.3%.